News Center – Page 6 – Laserion Photonics Technology Co., Ltd

Reliability Code | Measures for the Reliability of Sensor Data

Laserion 2026年6月12日 No Comments

With the advancement of laser technology, the industry’s requirements for the reliability of solid-state lasers have become increasingly stringent. The optical structure is the foundation for stable operation, and the electro-control…

What Is TGV (Through-Glass Via) Laser Drilling?

Laserion 2026年6月12日 1 Comment

Drilling a hole through glass sounds like it should be a matter of finding a strong enough laser. It isn’t. Glass is transparent, brittle, and unforgiving, and the reason TGV…

How Slab Integrated Amplification Reaches 100–300W?

Laserion 2026年6月11日 No Comments

Two ultrafast lasers can both say “300W” on the front of the datasheet and behave like different machines. The number is easy to compare. What it costs to reach that…

What Is Laser Pulse Duration? fs, ps, and ns Compared

Laserion 2026年6月10日 No Comments

When engineers compare lasers, they reach first for wavelength and power — the two numbers printed largest on every datasheet. For materials processing, that habit skips the variable that often…

How Do You Cut Frosted and Etched Glass Without Cracks?

Laserion 2026年6月9日 No Comments

Cutting clear glass cleanly is a solved problem for most shops. Frosted and etched glass breaks that confidence — the same process that runs all day on clear stock starts…

How Does Ultrafast Laser Wafer Dicing and Scribing Work?

Laserion 2026年6月9日 No Comments

For decades, separating dies from a wafer meant one thing: a spinning diamond blade. It still works for plenty of wafers. The reason ultrafast lasers keep taking over the hard…

How Ultrafast Lasers Achieve a Near-Zero Heat-Affected Zone

Laserion 2026年6月9日 2 Comments

The phrase “near-zero heat-affected zone” gets printed on every ultrafast laser datasheet, which makes it easy to read as a guarantee that comes with the box. It isn’t. It is…

TGV vs. TSV: Why Glass Interposers Are Rising

Laserion 2026年6月9日 1 Comment

For a decade, the through-silicon via was the obvious answer for 2.5D and 3D integration. The interesting part of the current shift is not that glass appeared — it is…

Bright-Field vs. Dark-Field Wafer Inspection Light Sources

Laserion 2026年6月9日 No Comments

Most teams frame this as a ranking question — which mode is more sensitive, which one to standardize on. That framing is where inspection coverage quietly springs a leak. Bright-field…

Picosecond vs. Nanosecond Laser: When Does Pulse Width Matter?

Laserion 2026年6月9日 1 Comment

The picosecond vs nanosecond laser debate usually gets framed as a quality tier — shorter pulse, better result, end of discussion. That framing sells a lot of picosecond sources for…

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