News Center – Page 5 – Laserion Photonics Technology Co., Ltd

UV Picosecond Laser Selection for Flex Circuit Cutting: Precision vs Throughput Tradeoff

Laserion 2026年6月25日 No Comments

I visited a flex circuit manufacturer last year who had just invested in a picosecond laser system. They expected dramatic improvements in edge quality and throughput. Instead, within weeks, they…

Ultrafast Laser Pulse Repetition Rate: How to Match It to Your Drilling / Cutting Process

Laserion 2026年6月24日 No Comments

The temptation is obvious. A 1 MHz repetition rate sounds better than 100 kHz. Faster pulse density, more material removed per second, shorter cycle time, higher throughput. So when we…

How Are Ultrafast Lasers Used in Advanced Semiconductor Packaging?

Laserion 2026年6月23日 No Comments

Advanced packaging sits at a materials inflection point. Glass interposers need precision via drilling without taper collapse. Ceramic heatspreaders demand edge quality that mechanical grinding destroys. Organic PCB layers must…

How Are Complex Glass Shapes Cut with Ultrafast Lasers?

Laserion 2026年6月22日 No Comments

A glass part can pass dimensional inspection and still be a reject. The shape is right, the corners are crisp, and then it snaps in a bend test — at…

Why High Power and Low M² Are Hard to Get Together — and What It Means for Your Process

Laserion 2026年6月19日 No Comments

A 300 W laser can put less power on your part than a 150 W one. That reads like a typo, and it is exactly the trap that catches teams…

How Are Through-Glass Vias (TGV) Drilled with Ultrafast Lasers?

Laserion 2026年6月18日 1 Comment

The cleaner pulse can be the one that cracks your vias. That sentence sounds wrong, which is exactly why so many TGV processes get specified backward — chosen on entrance-hole…

How Do Lasers Drill 50:1 Aspect-Ratio Holes in Glass?

Laserion 2026年6月17日 No Comments

A 50:1 hole in glass — fifty times deeper than it is wide — sounds like it should be a matter of enough power to push through. It isn’t. Glass…

What’s the Difference Between Rod, Slab, and Disk Laser Amplifiers?

Laserion 2026年6月16日 No Comments

Faced with three amplifier architectures — rod, slab, and disk — most engineers treat them as three separate technologies to study one by one. They are easier to understand than…

What Is Cold Laser Processing (Athermal Ablation)?

Laserion 2026年6月15日 No Comments

“Cold laser processing” is one of the most useful terms in ultrafast machining and one of the most misleading. The name suggests a gentle, low-energy beam, which is the opposite…

Laser Lift-Off (LLO): Process and Requirements

Laserion 2026年6月14日 No Comments

Most laser processes are judged by how cleanly they remove material. Laser lift-off is judged by the opposite — how well the material you are not trying to touch survives.…

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