News Center – Page 3 – Laserion Photonics Technology Co., Ltd

Provide a “Protective Umbrella” for Lasers — High-temperature Moisture-proof Maintenance Techniques

Laserion 2026年7月17日 No Comments

The combination of high temperature and high humidity in summer is the period when laser failure is high. Many people have a perception mistake: industrial equipment is “leather resistant to…

How to Eliminate Micro-Cracks in Ultrafast Laser Cutting of Brittle Materials?

Laserion 2026年7月17日 No Comments

When brittle materials like cover glass, sapphire, or quartz fracture during laser cutting, the instinct is almost universally the same: dial back the power. Engineers meticulously reduce single-pulse energy, convinced…

How to Achieve High-Contrast, Zero-Damage Laser Marking on Consumer Electronics Components?

Laserion 2026年7月16日 No Comments

When manufacturing consumer electronics, the assumption is that “zero damage” means minimizing laser power. We see engineers constantly dialing back the power on their nanosecond fiber sources, terrified of burning…

Peak Power vs. Average Power in Ultrafast Lasers: Balancing Throughput and HAZ

Laserion 2026年7月15日 1 Comment

To double the output of an alumina dicing line, the math seems dangerously simple: double the laser’s average power. If 50 watts gives you X parts per hour, then 100…

How UV Lasers Prevent Delamination in PCB Cutting

Laserion 2026年7月14日 No Comments

When micro-delamination appears on the cut edge of a flex PCB, the immediate instinct of any process engineer is to dial down the pulse energy. The prevailing assumption is that…

High-Power Picosecond Lasers: Why <1% RMS Stability is the True Metric for 24/7 Production

Laserion 2026年7月13日 1 Comment

The night shift is where laser lines go to die. During the day, engineers monitor the process, tweak parameters, and keep the yield numbers looking acceptable. But at 2:00 AM,…

GR Picosecond Laser: the Core Tool that Enables Efficient Manufacturing of Photovoltaics

Laserion 2026年7月10日 No Comments

In the industrial application field of picosecond lasers, the infrared band, owing to its wideadaptability, has alreacdy been successfully scaled and validated in intelligent manufacturing scenarios.In application scenarios such as…

Scaling Cover Glass Throughput: High-Power Picosecond Lasers for Smartphones and Wearables

Laserion 2026年7月10日 No Comments

The pressure on consumer electronics production lines is relentless. When a major brand demands a 3x increase in cover glass output for their next flagship phone, the first instinct is…

Scaling to 300W: Why Higher Laser Power Destroys Cutting Precision (And How to Prevent It)

Laserion 2026年7月9日 No Comments

The mandate from management was simple: triple the throughput of the micro-machining line. The engineering path seemed just as clear: upgrade the ultrafast laser source from 100W to 300W. The…

Ultrafast Laser Processing of SiC/GaN Wafers: Minimizing Edge Chipping and Thermal Damage

Laserion 2026年7月8日 No Comments

The semiconductor industry operates on a rigid assumption: if you want to cut hard, brittle materials like silicon carbide (SiC) and gallium nitride (GaN) without shattering them, you must use…

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