Drilling a hole through glass sounds like it should be a matter of finding a strong enough laser. It isn’t. Glass is transparent, brittle, and unforgiving, and the reason TGV…
Cutting clear glass cleanly is a solved problem for most shops. Frosted and etched glass breaks that confidence — the same process that runs all day on clear stock starts…
For decades, separating dies from a wafer meant one thing: a spinning diamond blade. It still works for plenty of wafers. The reason ultrafast lasers keep taking over the hard…
For a decade, the through-silicon via was the obvious answer for 2.5D and 3D integration. The interesting part of the current shift is not that glass appeared — it is…
Most teams frame this as a ranking question — which mode is more sensitive, which one to standardize on. That framing is where inspection coverage quietly springs a leak. Bright-field…
Ask how alumina ceramic laser cutting reaches ±1µm, and most engineers reach for the obvious answer: tighter focus and more power. Both feel right. Both miss what actually sets the…
Most teams I work with open the light-source decision by asking how much power they can get. It’s the wrong first question. In wafer defect inspection, the brightest source is…
Most engineers I talk to arrive at the femtosecond versus picosecond laser decision already leaning one way. Femtosecond feels like the safer bet: shorter pulse, smaller heat-affected zone, the premium…
In the first two articles of the TGV series, we exploredthe industrialization path of TGV technology, as well asthe specific processing results of Huachuang Hongdu’s TGV technology on Schott BF33…
△ A Display of Metal Materials Copper foil, gold-plated copper, aluminum alloy, and other metallic materials，rely on their excellent electrical conductivity, thermal conductivity, and mechanical properties, play a crucial role in…
