Application - Laserion Photonics Technology Co., Ltd

Aluminum Nitride PCB Cutting: UV Picosecond Laser Process Record

Laserion 2026年8月14日 No Comments

△ Ceramic PCB Material Display Aluminum nitride （AIN） ceramic PCBs , with their excellent characteristics of high thermal conductivity and high insulation, are widely used in AI optical modules , semiconductors, automotive…

Precision Engraving of Gilded Glass: “Golden Cisterning” by UV Picosecond Laser

Laserion 2026年7月24日 No Comments

△ Showcase of Coating Glass Materials In high-end manufacturing fields such as consumer electronics, photovoltaics, and semiconductors, it is often necessary to pattern glass substrates with high precision, which poses…

OLED & Full-Screen Display Laser Cutting: Which Laser Source Fits Your Line?

Laserion 2026年7月1日 No Comments

Nobody scraps a raw glass blank. They scrap a panel that has already traveled through deposition, encapsulation, lamination — a part carrying nearly its entire built-in cost before the laser…

What Laser Light Source Achieves Sub-5µm HAZ in HDI Microvia Drilling Without Recast Layer?

Laserion 2026年6月29日 No Comments

A qualification report came back clean. HAZ measured at 8–12 µm. Desmear was removing resin smear from the target pad. IPC-6012 Class 3 thresholds were met. The engineering team signed…

UV Picosecond Laser Selection for Flex Circuit Cutting: Precision vs Throughput Tradeoff

Laserion 2026年6月25日 No Comments

I visited a flex circuit manufacturer last year who had just invested in a picosecond laser system. They expected dramatic improvements in edge quality and throughput. Instead, within weeks, they…

How Are Ultrafast Lasers Used in Advanced Semiconductor Packaging?

Laserion 2026年6月23日 No Comments

Advanced packaging sits at a materials inflection point. Glass interposers need precision via drilling without taper collapse. Ceramic heatspreaders demand edge quality that mechanical grinding destroys. Organic PCB layers must…

How Are Complex Glass Shapes Cut with Ultrafast Lasers?

Laserion 2026年6月22日 No Comments

A glass part can pass dimensional inspection and still be a reject. The shape is right, the corners are crisp, and then it snaps in a bend test — at…

How Are Through-Glass Vias (TGV) Drilled with Ultrafast Lasers?

Laserion 2026年6月18日 1 Comment

The cleaner pulse can be the one that cracks your vias. That sentence sounds wrong, which is exactly why so many TGV processes get specified backward — chosen on entrance-hole…

How Do Lasers Drill 50:1 Aspect-Ratio Holes in Glass?

Laserion 2026年6月17日 No Comments

A 50:1 hole in glass — fifty times deeper than it is wide — sounds like it should be a matter of enough power to push through. It isn’t. Glass…

Laser Lift-Off (LLO): Process and Requirements

Laserion 2026年6月14日 No Comments

Most laser processes are judged by how cleanly they remove material. Laser lift-off is judged by the opposite — how well the material you are not trying to touch survives.…

Category: Application

Contact Us

联系我们