| Application | Description | Key Specifications |
|---|---|---|
| Alumina Ceramic Cutting | High-dielectric substrate processing |
Precision: ±1 µm HAZ: < 10 µm Burr: < 10 µm |
| Glass Profile & TGV Drilling | Through-glass via for advanced packaging |
Aspect Ratio: > 50:1 Taper: 0–15° Precision: ±3 µm |
| PCB / Flex-Board Cutting | Burr-free FPC and rigid PCB processing |
Tolerance: ±3 µm Edge Quality: Burr-free HAZ: < 10 µm |
| Metal & Carbon-Fiber Precision Processing | Clean edges with minimal recast |
Edge: Clean Recast: Minimal |
| IC Thin-Film & Medical Tubing Processing | Sub-surface patterning and stent cutting |
Feature Size: < 5 µm Application: Medical / IC |
| Wafer Defect Inspection Light Source | High-repetition UV illumination |
Repetition Rate: Up to 120 MHz Wavelength: 266–355 nm |
| Quantum Communication & Sensing | Narrow-linewidth single-frequency source |
Mode: Single-frequency Domain: Quantum-grade |
